Event Overview
The conference itself is TBM Group’s premier U.S. event dedicated to addressing the unique challenges and opportunities in building the next generation of semiconductor fabrication facilities. This exclusive forum gathers leading professionals and industry experts, including semiconductor manufacturers, construction firms, engineering and design specialists, technology providers, and regulatory authorities.
The event shines a spotlight on cutting-edge innovations, best practices, and emerging trends shaping the semiconductor fab landscape across the Americas. Attendees will gain valuable insights through expert-led presentations, dynamic panel discussions, real-world case studies, and exceptional networking opportunities.
Why This Event Now
As the semiconductor industry undergoes a critical expansion in North America, driven by reshoring efforts, technology advancements, and skyrocketing demand for chips, fab facilities must be designed and constructed with unmatched precision and operational excellence. Efficient construction, innovative design, and advanced engineering are crucial to delivering scalable, clean, and highly controlled environments that meet rigorous manufacturing standards.
With growing demands to improve sustainability, integrate advanced utilities, and comply with complex regulations, this conference serves as the essential platform to tackle the industry’s most urgent challenges and offer practical solutions for building resilient, future-ready semiconductor fabs.
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Key conference presentation topics:
- How to provide a turn-key solution of a semiconductor fab within a short period of time from an end user point of view
- What is a wafer ramp rate and what influence does the ramp rate have on enabling continuous tool installation in the first place? What impact does it have on later revenue and financial planning?
- From Hard Hats to Heart Sets: The Human Side of Leadership, Growth, and Collaboration from Design to Production
- Integrated Project Delivery for Semiconductor Fabs: Aligning Stakeholders for Speed and Precision
- Data-Centric Project Collaboration and Management
- Eco-efficient floors and foundations: concrete technology, CO2 reduction and future flexibility for semiconductor fabs construction
- When is the best time to start with the design process? What data do we need in order to start?
- How can vendors and subcontractors help the General Contractors, Developers, and Owners build better
- Construction and design related pain points and challenges of owners in their facilities during operating stage and how do we solve them
- Comparison of Semiconductor projects in USA, EU and ASIA on requirements, permits, costs, time
- Digital Twins and BIM for Semiconductor Facility Delivery: From Design Integrity to Construction Execution
- Facility Water considerations. Processes and Delivery Implications
- Innovative and flexible contracting, procurement and delivery models – How can it benefit the semiconductor industry?
- Talent Bottlenecks in Semiconductor fab construction: How recruitment partnerships accelerate project delivery
SPEAKERS
Clint Richmond
Senior Project Manager
Gray, USA
KiSeok Jeon
VP, Digital Advisory
STV, USA
Suzanne Bennett
Vice President & Business Leader – NextDirectSM
Gilbane, USA
Art Quijano
MEP Manager
Turner Construction Company, USA
Mark Wafford
Construction Solutions Executive
Sherwin Williams, USA
Mohamed Sawan
Vice President and General Manager
World Wide Professional Solutions, USA
Tim Johnson
Vice President & Business Leader – Advanced Technology and Data Centers
Gilbane, USA
Tiziano Petrosino
Head of Facilities, EHS and Security
LFoundry, Italy
Paul Roessler
Global Facilities Construction Manager
Lam Research, USA
Tim Weston
Project Development - Manufacturing and Industrial
Brasfield & Gorrie, USA
Scott Aicher
President/Board Member
CXC Global, USA
Julian Helmi
CTO & Founder
Prime Construction, USA
Masroor Malik
Solution Specialist of Semiconductor Market
Swagelok Company, USA
Sergio Sontag
Business Development Manager
ARC Energy Services, USA
Thomas Quarg
Director Semiconductor Infrastructure / facility management
ams-Osram, Germany
Roxxann Sczepanik
Partner
Joseph Chris Partners, USA
Guy Bar-Ner
Program Manager
Intel Corporation, USA
Randy Drake
Executive Vice President
Gresham Smith, USA
Deepshikha Shekhawat
Business Intelligence Program Manager
AMD, USA
Ravi Wood
BIM Manager
Samsung Semiconductor, USA
Andy Stapleton
Vice President
Mortenson, USA
Cameron Meyer
Manager, T1 Infra Technology Construction
Samsung Semiconductor, USA
James Murphy
Senior Vice President, National Development Director – East
STV, USA
Ciaran Carr
Senior Vice President, Talent Solutions
SilverBack Connects, USA
Matt Gulley
Vice President & General Manager
Turner Construction Company, USA
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